Semiconductor Chip Packaging Market | Growing Use of Semiconductors within the Car Sector will Drive Development | Analysis Report by Technavio

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Semiconductor Chip Packaging Market | Increasing Use of Semiconductors in the Automobile Sector will Drive Growth | Research Report by Technavio


LONDON–(BUSINESS WIRE)–The worldwide semiconductor chip packaging market measurement is poised to develop by USD 365.55 billion throughout 2020-2024, progressing at a CAGR of over 26% all through the forecast interval, in keeping with the most recent report by Technavio. The report presents an up-to-date evaluation relating to the present market situation, newest traits and drivers, and the general market atmosphere. The report additionally offers the market influence and new alternatives created because of the COVID-19 pandemic. Obtain a Free Pattern of REPORT with COVID-19 Disaster and Restoration Evaluation.

The rising use of semiconductors within the car sector will drive the expansion of this trade throughout the forecast interval. A wide range of semiconductor ICs are utilized in automotive merchandise reminiscent of GPS, airbag management, anti-lock braking system (ABS), energy doorways and home windows, infotainment, automated driving, and collision detection know-how. Aside from these components the rise in automobile manufacturing, can even enhance the demand for digital units. This in flip will not directly set off the demand for semiconductor chip packaging throughout the forecast interval.

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Report Highlights:

  • The foremost semiconductor chip packaging market development got here from the OSAT section because of the improvement of latest applied sciences reminiscent of fan-out wafer-level packaging.
  • APAC was the biggest semiconductor chip packaging market in 2019, and the area will provide a number of development alternatives to market distributors throughout the forecast interval. That is attributed to components such because the presence of a number of semiconductor manufacturing models and the rising demand for semiconductor ICs.
  • The worldwide semiconductor chip packaging market is fragmented. Amkor Know-how Inc., Utilized Supplies Inc., ASM Pacific Know-how Ltd., ChipMOS TECHNOLOGIES Inc., Greatek Electronics Inc., Kulicke and Soffa Industries Inc., nepes Corp., Tokyo Electron Ltd., Tokyo Seimitsu Co. Ltd., and Veeco Devices Inc. are a number of the main market contributors. To assist shoppers enhance their market place, this semiconductor chip packaging market forecast report offers an in depth evaluation of the market leaders.
  • Because the enterprise influence of COVID-19 spreads, the world semiconductor chip packaging market 2020-2024 is predicted to have a damaging influence. Because the pandemic spreads in some areas and plateaus in different areas, we proceed to revaluate the influence on companies and replace our report forecasts.

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Improve within the measurement of silicon wafers might be a key market pattern

The shift to longer diameter wafers reduces the price of manufacturing semiconductor ICs by practically 20%-25%. Current semiconductors have elevated the dimensions of the silicon wafers from 100 mm to 300 mm due to the above-mentioned purpose. This pattern is predicted to assemble additional momentum throughout the forecast interval as corporations are investing a considerable quantity in developing and upgrading fabs to fabricate 300-mm wafers. With the success of this, there are few current developments the place the trade is planning to develop 450-mm wafer know-how, which can even have a constructive influence on the semiconductor chip packaging market.

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Semiconductor Chip Packaging Market 2020-2024: Key Highlights

  • CAGR of the market throughout the forecast interval 2020-2024
  • Detailed data on components that can help semiconductor chip packaging market development throughout the subsequent 5 years
  • Estimation of the semiconductor chip packaging market measurement and its contribution to the father or mother market
  • Predictions on upcoming traits and modifications in shopper habits
  • The expansion of the semiconductor chip packaging market
  • Evaluation of the market’s aggressive panorama and detailed data on distributors
  • Complete particulars of things that can problem the expansion of semiconductor chip packaging market distributors

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Associated Reviews on Info Know-how Embody:

Discrete Diode Market by Finish-user and Geography – Forecast and Evaluation 2020-2024: The discrete diode market measurement has the potential to develop by USD 431.64 million throughout 2020-2024, and the market’s development momentum will speed up throughout the forecast interval.

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Semiconductor Manufacturing Tools (SPE) Market in Southeast Asia 2017-2021: This market analysis research identifies ASML, KLA-Tencor, LAM Analysis, and Tokyo Electron because the main gamers within the semiconductor manufacturing tools (SPE) market in Southeast Asia. A complete evaluation of this market can be introduced by end-user reminiscent of reminiscence section, foundry section, and IDM section.

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Govt Abstract

Market Panorama

  • Market ecosystem
  • Worth chain evaluation

Market Sizing

  • Market definition
  • Market section evaluation
  • Market measurement 2019
  • Market outlook: Forecast for 2019 – 2024

5 Forces Evaluation

  • 5 Forces Abstract
  • Bargaining energy of consumers
  • Bargaining energy of suppliers
  • Menace of latest entrants
  • Menace of substitutes
  • Menace of rivalry
  • Market situation

Market Segmentation by Finish-user

  • Market segments
  • Comparability by Finish-user
  • OSATs – Market measurement and forecast 2019-2024
  • IDMs – Market measurement and forecast 2019-2024
  • Market alternative by Finish-user

Market Segmentation by Method

  • Market segments
  • Comparability by Method
  • 3DIC TSV stacks – Market measurement and forecast 2019-2024
  • 2.5D interposers – Market measurement and forecast 2019-2024
  • Flip-chip wafer bumping – Market measurement and forecast 2019-2024
  • FO WLP/SiP – Market measurement and forecast 2019-2024
  • Others – Market measurement and forecast 2019-2024
  • Market alternative by Method

Buyer Panorama

Geographic Panorama

  • Geographic segmentation
  • Geographic comparability
  • APAC – Market measurement and forecast 2019-2024
  • North America – Market measurement and forecast 2019-2024
  • Europe – Market measurement and forecast 2019-2024
  • South America – Market measurement and forecast 2019-2024
  • MEA – Market measurement and forecast 2019-2024
  • Key main international locations
  • Market alternative by geography
  • Market drivers – Demand led development
  • Market challenges
  • Market traits

Vendor Panorama

  • Vendor panorama
  • Panorama disruption

Vendor Evaluation

  • Distributors coated
  • Market positioning of distributors
  • Amkor Know-how Inc.
  • Utilized Supplies Inc.
  • ASM Pacific Know-how Ltd.
  • ChipMOS TECHNOLOGIES Inc.
  • Greatek Electronics Inc.
  • Kulicke and Soffa Industries Inc.
  • nepes Corp.
  • Tokyo Electron Ltd.
  • Tokyo Seimitsu Co. Ltd.
  • Veeco Devices Inc.

Appendix

  • Scope of the report
  • Forex conversion charges for US$
  • Analysis methodology
  • Checklist of abbreviations

About Us

Technavio is a number one world know-how analysis and advisory firm. Their analysis and evaluation focuses on rising market traits and offers actionable insights to assist companies establish market alternatives and develop efficient methods to optimize their market positions. With over 500 specialised analysts, Technavio’s report library consists of greater than 17,000 experiences and counting, overlaying 800 applied sciences, spanning throughout 50 international locations. Their consumer base consists of enterprises of all sizes, together with greater than 100 Fortune 500 corporations. This rising consumer base depends on Technavio’s complete protection, in depth analysis, and actionable market insights to establish alternatives in current and potential markets and assess their aggressive positions inside altering market eventualities.



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